3.5" Form Factor

PC/104

PC/104-Plus

PCIe/104

PCI/104-Express

COM Express

Single Board Computers

I/O Modules

Power Supplies

Single Board Computers

I/O Modules

Power Supplies

I/O Modules

Single Board Computers

Cables

PC/104

Adapters

PC/104

PC/104-Plus

PCIe MiniCard

PC/104

PCIe MiniCard

PC/104

PC/104-Plus

PCI/104-Express

PCIe MiniCard

PC/104-Plus

PCIe MiniCard

PC/104-Plus

PCIe MiniCard

I/O Modules

Single Board Computers

I/O Modules

PC/104

PC/104-Plus

PC/104

Small form factor

Ethernet Switch Modules

Single Board Computers

Ethernet Switches

AGX Orin Solutions

ORIN Nano / NX

Nano and NX Solutions

AGX Xavier Module Solutions

TX2 / TX2i Module Solutions


Level 1 Integration: Hardware Core

The Hardware Core sub-assembly integration begins with development of a requirements document that defines the system in detail. Diamond's integration team forms a baseline solution using off-the-shelf products from Diamond Systems as well as our third party partners. We then take into consideration any design needs for ruggedization or customization of these standard board-level products. We validate the core hardware to ensure compatibility and performance. The hardware core is assembled and functionally tested using our standard acceptance tests or customer-supplied software.

Level 1 Example

Industrial: Remote Data Collection System

This application involved the collection of vibration data on bridges using a solar-powered system with battery backup. The boards were assembled into a custom enclosure. The low-power system runs Linux from a solid state flashdisk mounted on the Prometheus CPU

Integration Quicklinks
Level 1: Hardware Core Sub-Assemblies
Level 2: System Level Assemblies
Level 3: OEM Ready Solutions
System Components:

Prometheus CPU board with integrated data acquisition
HESC-104 DC/DC power supply with smart charger
BAT104 backup battery