The EPSM-10GX is a managed Ethernet switch module in an ultra-compact 2.2" x 3.3" (55 x 84mm) size offering
24 10/100/1000Mbps copper ports + 2 10Gbps SFI ports. The core Ethernet switching technology is almost fully encapsulated on the module;
for many applications, only the "last inch" of magnetics and I/O connectors is required to complete the circuit, enabling easy development
of custom form factor compact, rugged Ethernet switch solutions.
The small size, based on the industry-standard COM Express Mini form factor, makes EPSM-10GX a perfect choice for
use as a building block for creating custom Ethernet switch solutions in a variety of space-demanding applications, such as drones, ground and
underwater vehicles, and robots.
Two software packages are available, Layer 2+ switching and Layer 3 routing/switching. In addition, IEEE-1588 precision
time protocol support is available with a minor modification to support an external precision clock circuit and 1pps signal source provided
by the carrier board. All software features are manageable via a GUI web interface accessible over any port, as well as with a
command language accessed via a built-in RS-232 port.
Two cooling accessory options are available: A heat sink provides convection cooling in a low profile, while a heat spreader
provides improved conduction cooling for superior high temperature performance in applications where physical contact with the system enclosure
Two high-speed fine-pitch connectors provide all power and data communications between the module and the carrier board.
The first connector provides power, 9 10/100/1000 ports, the serial interface, and a serial LED data stream. Applications requiring 9 ports
or less may use just this connector. The second connector contains 3 more 10/100/1000 ports, QSGMII signals for an additional 12-port PHY to
provide 12 additional 10/100/1000 ports, and the 2 10G SFI ports.
EPSM-10GX is designed to meet the challenges of vehicle environments with its 50% thicker PCB, -40/+85°C operating
temperature range, and MIL-STD-202G shock/vibration resistance.
Two software packages are available for EPSM-10GX, Layer 2+ switching and Layer 3 routing/switching. In addition,
IEEE-1588 precision time protocol support is available with a minor modification to support an external precision clock circuit and
1pps signal source provided by the carrier board. All software features are manageable via a GUI web interface accessible over any port,
as well as with a command language accessed via a built-in RS-232 port.
The table below shows some of the more popular features available. For a complete list of features available in
each software package, click here.
Layer 2+ software highlights include the following:
8K MAC addresses and 4K VLANs (IEEE 802.1Q)
8K IPv4 and IPv6 multicast group support
Jumbo frame support at all speeds
Flexible link aggregation support based on Layer-2 through Layer-4 information (IEEE 802.3ad)
Multicast and broadcast storm control, as well as flooding control
Rapid Spanning Tree protocol (RSTP) and MSTP
Multiple protocol support: IEEE 802.1d, IEEE 802.1w, IEEE 802.1s, and IEEE 802.1X
8 priorities and 8 QoS queues per port with scheduling
Layer3 software additional highlights:
Hardware- and software-based IPv6 L3 static routing
RFC 2328 OSPFv2 dynamic routing
IEEE 1588 precision time protocol (PTP)
Port and Queue policers
Both heat sink and heat spreader cooling options are available. The heat spreader is the preferred choice for
applications where the packaging design permits its use. It includes an integrated thermal pad for improved contact with the
enclosure wall. For customer’s designing their own cooling solutions, Diamond can provide 3D files and other design support./p>
A design guide is available with circuit details and other technical information necessary to design a carrier
board around the EPSM-10GX. A complete development kit is also available including the technical design package (schematics, PCB layout,
and BOM) of our EPS-24G4X carrier board, along with a complete EPS-24G4X switch and cable kit. Contact Diamond Systems for
further information and ordering instructions.
||Custom Carrier Board Design
Diamond Systems engages in the design and manufacturing of of custom carrier boards for various computing technologies,
including COM Express, Nvidia Jetson GPU modules, and Ethernet switch modules. Contact us to learn more about how we can provide a cost-effective,
low-risk, quick time to market solution for your Ethernet switch project using the EPSM-10GX switch module and a custom carrier board that
fits your exact needs.
|Number of Ports
||24 10/100/1000Mbps Ethernet ports with non-blocking wire-speed performance
2 10G SFI ports for fiber or copper transceivers
Magnetics and 10G transceivers required on carrier board
||12 PHYs integrated on main board; QSGMII signals for additional 12-port PHY on carrier board
||4MB packet memory
||SNMP v1/v2c/v3; Web GUI and command line interface (CLI)
||ActiPHY and PerfectReach power management reduce power for shorter cable lengths and shut down power to disconnected ports
||1 serial port for host interface; RS-232 transceiver required on carrier board
||Serial data stream provided for 2 LEDs per port; decoder logic required on carrier board
||55x84mm / 2.17x3.31” (Same as COM Express Type 10)
||Dual Samtec ERF5 series connectors, 120 pins each, 10mm board to board spacing
||20W max, all ports active
||-40 to +85°C with DSC-provided heat sink or heat spreader
||Heat sink, 55x84mm, 16.6mm height
Heat spreader, 55x104mm, 7.6mm height
||85G / 3.0 oz