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Embedded-Ready Subsystems

An Embedded-Ready Subsystem (ERS) combines the high-performance processing and leading-edge system I/O capabilities of computer-on-modules (COMs) with the modular expansion flexibility of stackable single board computers, all within a single compact, rugged, reliable, pre-integrated module. Additionally, the modules' large thermally-conductive baseplate provides both an efficient cooling solution and a standardized mounting-hole pattern that ensures interchangeability for alternate features or performance upgrades.

An ERS consists of three layers, as illustrated below. The central core of the ERS is its COM layer. Below the COM layer is the thermally-conductive baseplate layer. Above the COM layer is the application layer, which provides I/O interface connectors, expansion module sockets, and in many cases additional functionality.
com express system
(click to enlarge)

This innovative design provides optimal theremal management, and makes it possible for the ERS to integrate complete embedded-PC functionality plus a full set of peripheral interface header connectors, stackable PC/104-style expansion, a FeaturePak socket, an on-board flashdisk, and extra feaures such Ethernet interfaces, serial ports, and an on-board DC/DC power supply -- all within compact form-factors such as the 95mm x 125mm COM Express footprint. These highly integrated board-level subsystems can be used as plug-and-play embedded components, or as platforms for application development and reference designs.

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Embedded-Ready Subsystem Familes

Diamond's Embedded-Ready Subsystems are based on our wide-temperature, rugged, COM Express and ETX 3.0 COMs. Click below for detailed product information.

 

  >  >   Read the Embedded-Ready Subsystems whitepaper   <  <

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Other Processor Module Familes

Diamond's product line also includes following Processor Module families:
etx com system
(click image to download ERS whitepaper)


Featured Product
com express system
Magellan -- Rugged, wide-temperature COM Express form-factor Embedded-Ready Subsystem with SUMIT, PCI-104, and FeaturePak expansion and configurable COM Express CPU. Also provides an additional gigabit Ethernet port, four serial ports, a USB flashdisk option, and an on-board DC/DC power supply.