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Products   >   Systems   >   Rugged Systems   >   Geode-JSP
      GEODE-JSP  Quick-Ship Easy-Expansion Rugged Systems   COMExp    PCIe104
Geode-JSP: Systems, Compact, high quality, rugged systems built around Diamonds single board computers and I/O modules. ,
OverviewBlock
Diagram
Mass Storage and
I/O Expansion
Ordering
Information
Support

The GEODE rugged computer system platform offers easy customization and quick availability for rugged computers due to its novel architecture that includes pre-integrated expansion connectors for easy addition of I/O, plus the use of COM Express modules to support flexible CPU choices. In addition to the standard computer I/O features, GEODE supports up to 3 I/O boards with up to 110 additional I/O signals without requiring any change to the enclosure or cabling. The elimination of custom enclosure and cabling design efforts dramatically reduces up-front costs and delivery times, and the resulting use of common components across multiple product configurations helps keep production costs down and facilitates the production of small quantities for pilot or small-run programs.

The COM is thermally coupled to the top surface of the enclosure with a conduction cooling heat spreader and mounting plate. (Heat spreader removed for illustration purposes, normally present in the open rectangle in the mounting plate)

Geode-JSP: Systems, Compact, high quality, rugged systems built around Diamonds single board computers and I/O modules. ,

The optional filtered 80-watt power supply is thermally coupled to the bottom surface of the enclosure using a conduction cooling mounting plate with thermal pads on both sides.

Geode-JSP: Systems, Compact, high quality, rugged systems built around Diamonds single board computers and I/O modules. ,

The entire system is housed in a rugged 3-part enclosure that eliminates all T joints and includes seals at all joints to ensure IP67 compliance.

Geode-JSP: Systems, Compact, high quality, rugged systems built around Diamonds single board computers and I/O modules. ,

GEODE is based on Diamond’s JASPER COM Express carrier board featuring a high level of I/O as well as multiple sockets for I/O expansion. The optional integrated data acquisition circuit provides high-accuracy analog I/O with autocalibration and programming library support. Dual minicard sockets and a PCIe/104 socket with PCIe x1 and x16 links (depending on the installed COM) enable feature upgrade with the widest range of I/O modules, from low-cost minicards up to high-performance graphics and 10Gb Ethernet, all without modifying the case or cables.

Geode-JSP: Systems, Compact, high quality, rugged systems built around Diamonds single board computers and I/O modules. ,

Diamond's JMM-7500 MIL-grade rugged power supply with MIL-STD-461, -704, and -1275 compatibility and 9-60VDC range. The supply is available with both isolated and non-isolated output configurations. As a cost and weight reduction alternative, a MIL-STD-461 filter circuit is built right into the connector board, eliminating the separate power supply for applications where 461 filtering alone is sufficient. Both the processor and power supply are direct-coupled to the enclosure for efficient conduction cooling.

Geode-JSP: Systems, Compact, high quality, rugged systems built around Diamonds single board computers and I/O modules. ,

Geode-JSP: Systems, Compact, high quality, rugged systems built around Diamonds single board computers and I/O modules. ,

Mass Storage and I/O Expansion

Mass storage is provided by an M.2 2242/2280 size solid-state disk module with capacity up to 2TB. Additional storage can be provided with an add-on drive using the built-in SATA connector.

I/O expansion is readily accomplished with the use of PCIe / USB minicards as well as PCIe/104 I/O modules. The PCIe/104 socket supports up to 4 x1 links and 1 x16 link, depending on the installed COM. A Core i7 or lower performance COM will typically support 3-4 PCIe x1 links. A Xeon or higher COM will typically support the x1 links as well as the x16 link.

Direct-Coupled Connector Board Eliminates Cables

Internal cables are a leading cost, leadtime, and size driver for rugged systems, as well as usually the most failure-prone element in the design. With Geode, most I/O connectors are mounted on a circuit board that plugs directly into the main computer board and eliminates most internal cables. This design reduces cost, reduces failure, reduces size, increases ruggedness, and simplifies assembly. Attachment points are provided for optional dust caps for all connectors. The rightmost connector is on a breakaway portion of the circuit board and can be removed to support smaller systems that have lesser I/O requirements.

Geode-JSP: Systems, Compact, high quality, rugged systems built around Diamonds single board computers and I/O modules. ,

One front panel I/O connector is reserved for cable connection to allow flexibility and support high speed interfaces such as USB 3.0, high speed graphics, and 10G Ethernet. The default system configuration provides USB 3.0 in this position.

Geode-JSP: Systems, Compact, high quality, rugged systems built around Diamonds single board computers and I/O modules. ,

How to Order

Geode Systems are configured to order based on customer I/O requirements. Depending on your I/O needs and current stock levels, a Geode system can be configured and shipped in as little as one week. Contact Diamond Systems Sales to discuss your system requirements and obtain a quote.

sales@diamondsystems.com

The Jasper standard enclosure and panel board can satisfy a preponderance of typical rugged system requirements. The design can also be customized for special situations, for example to change the size or type of the I/O connectors or to install SMA connectors for antenna attachment.

Product Support for Geode-JSP

Mechanical Drawing

GEODE mechanical drawing new design(.pdf, 462.1 KB)
FEATURES
Easy customization and quick ship due to elimination of bulky cables and custom case & cable design
COM Express architecture provides performance scalability and earlier access to latest generation processors
Base model includes 11th Gen Core i7 CPU, 32GB RAM, HDMI, 2x GbE, 2x USB 3.0, 2x USB 2.0, 4x RS-232/422/485
Expandable with PCIe/104 and minicard I/O modules
Standard model can support 1 LC fiber port and up to 110 I/O expansion signals
IP67 sealed construction with fully gasketed design
High-speed rugged circular connectors support reliable HDMI and USB 3.0 signaling; MIL-DTL-38999 connectors used for remaining I/O
MIL-STD-810H shock/vibration rated
MIL-STD-461 / 704 / 1275 compliant power supply with 9-60VDC input and isolation
-40 to +80C operating temperature
9.1 x 0.7 x 4.1 in / 230 x 179 x 104 mm WxDxH
5.8 lbs / 2.6Kg base model