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Products   >   Processor Modules   >   Single Board Computers   >   Jasper
      JASPER  Rugged COM Express Type 6 Carrier Board and SBC with Rich I/O and Expansion   COMExp    PCIe104
OverviewBlock
Diagram
COM-Based DesignData
Acquisition
Ordering
Information
Support

Jasper is a COM Express carrier board and SBC for Type 6 Basic (125x95mm) and Compact (95x95mm) modules. It is designed for applications that require ruggedness, a high level of I/O, or extended product lifetime. Notable features of Jasper include:

  • Rugged mechanical design with thicker PCB and latching connectors
  • Wide temperature operation – up to -40 to +85C (depending on the installed COM)
  • Built-in 16-bit data acquisition circuit with autocalibration
  • Dual minicard sockets with PCIe and USB interfaces
  • Dual M.2 sockets for flash memory and network connectivity
  • PCIe/104 expansion socket supporting x16 and x1 links

Jasper is available as a carrier board alone, for user integration with a COM of your choice, or as a ready to run “single-board computer” with an 11th generation Intel Xeon processor COM installed. Both Windows and Linux OS support are standard, while other OS support is available upon request.

Flexible Design to Fit Any Application

The most popular I/O on Jasper is provided on a single row of connectors along the front edge of the PCB. This arrangement supports dual connection modes. First Jasper can be used with traditional cables, with each cable providing a positive locking feature for increased shock and vibration resistance. Secondly the single row of connectors makes it easy to design and build I/O connector boards that match the end application’s exact requirements. For example a connector board with commercial connectors (RJ-45, USB type A, etc.) or MIL-DTL-38999 rugged circuit connectors can be plugged directly into the Jasper I/O connectors to create a “cable-free” solution. Such a connector board can dramatically reduce assembly time and cost for the end system.

Jasper: Processor Modules, Rugged, wide-temperature SBCs in PC/104, PC/104-<i>Plus</i>, EPIC, EBX, and other compact form-factors., 3.5 Inch
Jasper: Processor Modules, Rugged, wide-temperature SBCs in PC/104, PC/104-<i>Plus</i>, EPIC, EBX, and other compact form-factors., 3.5 Inch

Rugged design

Jasper was designed from the ground up with a comprehensive set of features to meet the challenges of rugged environments and applications:

  • The 50% thicker PCB increases rigidity and improves reliability of fine pitch and high-ball-count BGA solder joints
  • Almost all I/O connectors are positive latching (not friction lock) for increased ruggedness
  • A bottom-side heat spreader provides more efficient cooling than a traditional heat sink.
  • All components are rated and/or tested to ensure reliable -40 to +85 o C operation

Thermal Dissipation

Jasper supports installation of the COM and its heat spreader on the bottom side of the carrier. This enables more efficient mounting and heat dissipation, since the COM’s heat is directly coupled to the enclosure body instead of relying on a top-side heat sink to dissipate heat into the air inside. Jasper’s mounting plate surrounds the COM heat spreader to provide mounting stability for the entire board assembly.

I/O Expansion

Jasper includes dual PCIe minicard sockets with both PCIe and USB interfaces, supporting a wide range of I/O and communications/networking modules from Diamond as well as third party vendors. It includes an M.2 E key socket for installation of wifi and other networking modules. The PCIe/104 socket enables use with PCIe/104 Type 1 I/O modules using x1, x4, x8, and x16 PCIe links (depending on the capability of the installed COM) as well as PCIe/104 OneBank modules using the x1 lanes on the first connector bank.

Cable Kit

The Jasper cable kit includes cables for all I/O and features on the board. All cables except for SATA have positive latching feature for resistance to shock and vibration.


Jasper Cable Kit

CK-JSP-01 includes the following cables:

No. Qty Cable Description Drawing
1 1 6980512 Power input cable, discrete wires Show
2 1 6980524 External battery cable, discrete wires Show
3 2 6980601 Dual serial port cable, 2x DB9 male Show
4 1 6980602 Dual USB 2.0 cable, 2x USB 2.0 type A Show
5 3 6980603 Dual USB 3.0 type A, latching Show
6 2 6980604 Ethernet cable, RJ-45 socket Show
7 2 6980605 HDMI Cable Show
8 1 6980608 Audio cable, 3x 3.5mm jacks Show
9 2 6980609 FCI latching 2x5 2mm to IC 2x5 2mm, 12" Show
10 1 6980612 Analog I/O, latching 2x15 2mm to DB37F panel mount Show
11 1 6980611 Digital I/O, latching 2x10 2mm to DB37F panel mount Show
12 1 6981084 VGA, 2x5 2mm latching to DD15F Show
13 1 6989101 SATA Cable, 7-Pin Data, Straight to Right Angle, 500mm Show

Jasper: Processor Modules, Rugged, wide-temperature SBCs in PC/104, PC/104-<i>Plus</i>, EPIC, EBX, and other compact form-factors., 3.5 Inch

COM-based architecture for long life and scalability

Jasper: Processor Modules, Rugged, wide-temperature SBCs in PC/104, PC/104-<i>Plus</i>, EPIC, EBX, and other compact form-factors., 3.5 Inch

A COM-based SBC is a 2-board solution consisting of a Computer-on-Module (COM) that contains the processor and core I/O mounted on a carrier board that provides additional I/O and user connections. The carrier board brings out the I/O from the COM and provides additional I/O derived from the expansion buses provided by the COM, such as PCIE, LPC, SATA, and USB. This 2-board architecture provides significant advantages over traditional single-board computers.

A true SBC with a soldered-on processor provides a compact and economical solution for embedded computing. However it also carries inherent risk compared to a COM-based design: The lifetime and features of the SBC are tied to the processor. Since no two SBCs are truly alike, if the processor reaches end of life or is otherwise unavailable, a redesign effort is required that can be painful as you try to match your existing system requirements to available replacement boards. A COM-based SBC solves this problem by allowing easy replacement of the COM with another one in the exact same size with the exact same features. COMs maintain much more similarity from product to product than SBCs, so replacing a COM is far less likely to present complications than replacing the entire SBC. This enables COM-based products to enjoy much longer lifetimes than traditional SBC designs, with far lower lifecycle extension efforts.

A COM-based solution is also ideal during periods of supply chain uncertainty. If one vendor’s COM is unavailable, it is much easier to select a substitute COM than to replace the entire SBC.

A COM-based design also supports the ability to upgrade the system performance much more easily by simply swapping one COM for another. The rest of the system remains the same as before.

Jasper is a member of Diamond’s 2-in-1 series of SBCs with integrated data acquisition. For applications requiring precision analog I/O, a 2-in-1 SBC is an ideal choice because it reduces the number of boards in the system, resulting in a system that is smaller, lighter, lower cost, and easier to assemble and maintain. The features of the Jasper DAQ circuit surpass those found on most other embedded SBCs in both variety and quality, providing a comprehensive, professional quality subsystem backed with top of the line software support. "A" models include the full DAQ circuit with both analog and digital I/O features, while "D" models include only the digital I/O features. (The DAQ circuit on Jasper is identical to the one found on our Saturn SBC.)

Jasper: Processor Modules, Rugged, wide-temperature SBCs in PC/104, PC/104-<i>Plus</i>, EPIC, EBX, and other compact form-factors., 3.5 Inch

The A/D circuit includes 16 single-ended / 8 differential analog input channels with programmable input ranges and a maximum aggregate sampling rate of 250KHz. A built-in programmable counter/timer supports accurate high-speed sampling with precise timing. The 2048-sample FIFO with programmable threshold ensures error-free sampling and enables you to tune the performance of the circuit to minimize interrupt processing overhead.

The D/A circuit consists of 4 16-bit D/A voltage outputs with independently programmable output ranges including 0-10V, +/-10V, 0-5V, and +/-5V. A 2048-sample waveform buffer is included to support arbitrary waveform generator functions on up to 4 channels simultaneously.

The digital I/O circuit consists of GPIO, counter/timers, and pulse-width modulators. The GPIO circuit provides 22 buffered digital I/O lines, consisting of one 8-bit port and 14 1-bit ports. Each port is individually programmable for input or output. The 1-bit direction controllable ports provide better matching of input and output quantities to each application. Jumper configuration enables selection of 5V/3.3V logic levels and pull-up or pull-down resistors on the digital I/O lines.

The 8 32-bit programmable counter/timers feature both up and down counting with clocking selectable from an external digital signal or the on-board 50MHz clock. Counters can be used for generating programmable output frequencies with programmable output pulse widths, counting external events, generating interrupts to the host processor at a programmable rate, and driving A/D sampling at precise frequencies with perfect timing between samples.

The circuit further includes 4 24-bit programmable pulse width modulators also driven by the on-board 50MHz clock. These feature programmable rate, duty cycle, and polarity, with real-time rate and duty cycle update capability.

Software Support

The data acquisition circuit on Jasper is supported by Diamond Systems' Universal Driver software. This software provides unmatched power and flexibility for embedded data acquisition programming with PC/104 and small form factor I/O boards. It provides flexible C-language programming support for Windows and Linux to control all data acquisition features on Jasper, as well as Diamond's MiniCard data acquisition modules that can be used with Jasper.

A powerful and convenient graphical control panel provides instant, easy access to all data acquisition features on the board. It can be used for proof of concept, testing, and even system debugging.

Visit our Universal Driver software page to learn more.

Get an online quote

 
Jasper
available models:
JSP-BB01D
Jasper COM Carrier, low cost model, 18-36VDC In
Min Order Qty
JSP-BB02D
Jasper COM Carrier, PCIe/104 expansion, Digital I/O, 18-36VDC In
Available
JSP-BB03A
Jasper COM Carrier, PCIe/104 and Data Acquisition, 18-36VDC In
Min Order Qty
6882210
Mounting Plate for Jasper Carrier
Available
JSP-1185G7E-64G-02D
Jasper SBC with Intel 11th Gen Core i7-1185G7E, 64GB RAM, DIO, 18-36VDC In
Available
JSP-1185G7E-64G-03A
Jasper SBC with Intel 11th Gen Core i7-1185G7E, 64GB RAM, DAQ, 18-36VDC In
Available
JSP-1185GRE-32G-02D
Jasper SBC with Intel 11th Gen Core i7-1185GRE, 32GB RAM Soldered, DIO, 18-36VDC In
Available
JSP-1185GRE-32G-02D
Jasper SBC with Intel 11th Gen Core i7-1185GRE, 32GB RAM Soldered, DIO, 18-36VDC In
Available
SDK-JSP-1185G7E-LNX64
Linux 64-bit Software Development Kit for Jasper SBC with 11th Gen Core i7
Available
SDK-JSP-1185G7E-WE1064
Windows 10 64-bit Software Development Kit for Jasper SBC with 11th Gen Core i7
Coming Soon
SDK-JSP-1185GRE-LNX64
Linux 64-bit Software Development Kit for Jasper SBC with 1185GRE processor
Available
SDK-JSP-1185GRE-LNX64
Linux 64-bit Software Development Kit for Jasper SBC with 1185GRE processor
Available
SDK-JSP-1185GRE-WE1064
Windows 10 64-bit Software Development Kit for Jasper SBC with 1185GRE processor
Available
SDK-JSP-1185GRE-WE1064
Windows 10 64-bit Software Development Kit for Jasper SBC with 1185GRE processor
Available
DK-JSP-1185G7E-LNX64
Jasper Development Kit: Jasper 11th Gen Core i7 SBC with DIO, 64GB RAM, Linux 64-bit OS
Available
DK-JSP-1185G7E-WE1064
Development Kit, Jasper SBC, 1185G7E CPU, Windows 10 64-Bit OS
Available
Please login or signup for an online quote request.


 
Cables and accessories
available models:
CK-JSP-01
CK-JSP-01 cable kit
6980512
Cable Power, 2x4 0.1" Latching to Discrete Wires, 15"L
6980524
Cable, External Battery, Molex Spox 2 Pos to Tinned Leads, 12ā€¯L
6980601
Cable, Dual Serial Port, FCI 98414 to 2x DB9M, 12"L
6980602
Cable, Dual USB 2.0, FCI 98414 to Dual Type A Panel Mount Receptacle, 12ā€¯L
6980603
Cable, USB 3.0, Latching 2x5 2mm to Type A Socket Panel Mount, 12"L
6980604
Cable, Ethernet, Latching 2x5 2mm to RJ-45 Socket Panel Moun, 12"L
6980605
Cable, HDMI, Latching 2x10 2mm to HDMI Panel Moun 12"L
6980608
Cable, Audio, Latching 2x10 2mm to 3x 3.5mm Stereo Jacks, 12"L
6980609
Cable, FCI Latching 2x5 2mm to IDC 2x5 2mm, 12"L
6980612
Analog I/O, latching 2x15 2mm to DB37F panel mount
6980611
Digital I/O, latching 2x10 2mm to DB37F panel mount
6981084
Cable, VGA, 2mm 2x5 conn to DD15F, 12"L
6989101
SATA Cable, 7-Pin Data, Straight to Right Angle, 500mm
Please login or signup for an online quote request.

Product Support for Jasper

User Manual

Jasper SBC User Manual(.pdf, 1.8 MB)
FEATURES
Supports COM Express Type 6 Basic & Compact modules
Available as complete solution with Intel 11th Gen Core i7 COM / up to 64GB RAM
Rugged design: latching connectors, thicker PCB, wide temperature, conduction cooling
2 Gigabit Ethernet, 2 USB 2.0, 3 USB3.1
4 RS-232/422/485 ports, HDA Audio
2 HDMI, dual-channel 24-bit LVDS Display
Dual PCIe MiniCard sockets with PCIe, SATA, and USB support
M.2 (NVME/SATA) and SATA connectors for mass storage
M.2 E key socket for networking modules
Data acquisition with 16 A/D, 4 D/A, 16 GPIO
PCIe/104 expansion with PCIe x1 and x16 links
12V or 18-36VDC Input
-40C to +85C operating temperature (depending on installed COM)
Dimensions: 5.75”W x 4.00”H / 146/102mm (3.5 inch form factor)