GEODE-OSB  Rugged system with Nvidia Jetson AGX Orin supporting up to 8 GMSL cameras

Original design; see new shorter design 3D images Original design; see new shorter design 3D images New shorter case design with camera connectors on sides New case design showing connector caps (included with system)	FEATURES Core Features Available with AGX Orin (32GB), AGX Orin 64GB, and AGX Orin 64GB Industrial modules Easy customization and quick ship due to elimination of bulky cables and custom case/cable design Rugged design featuring sealed construction and MIL-grade I/O connectors Reliable high-speed connectors support 10GbE, USB3, and HDMI interfaces I/O Features 1x 1Gb Ethernet + 1x 10Gb copper Ethernet 2x USB 3.2 ports with USB 2.0 fallback 2 additional USB 2.0 ports 2 RS-232 + 2 RS-232/422/485 ports 2x CAN, 8x GPIO 3.3V 60 pins User I/O on dedicated expansion connector; supports user-specified Minicard and M.2 I/O modules Support for up to 8 GMSL cameras using sealed Fakra connectors Mechanical / Environmental Input voltage: 9-36VDC (isolated), 7-20VDC (non-isolated) Optional MIL-grade 80W power supply with 9-36VDC input range and MIL-STD-461/704/1275 compliance -40 to +80C operation MIL-STD-810H shock and vibration tested and verified Dimensions: 241mm W x 215mm D x 98mm H / 9.5" W x 8.5" D x 3.9" H

The GEODE-Osbourne computer system platform offers easy customization and quick delivery, due to its novel architecture that includes pre-integrated expansion connectors for easy addition of I/O. Geode is based on Diamond's Osbourne carrier board for Nvidia Jetson AGX Orin. The system can support all three Orin modules: AGX Orin 32GB, AGX Orin 64GB, and Orin Industrial 64GB.

The I/O connector scheme consists of a mix of standard 38999 connectors plus dedicated SJT style connectors to support both low-speed and high-speed signals cost-effectively. In the high-speed category, Geode Osbourne supports 10Gb copper Ethernet, two USB 3.2 ports, and an HDMI port. Low-speed I/O consists of a 1Gb Ethernet port, 2 USB 2.0 ports, 2 RS-232 and 2 RS-232/422/485 serial ports, 2 CAN ports, 8 GPIO 3.3V, and Audio.

Since no two rugged computer systems are exactly alike, GEODE supports up to 60 additional I/O signals and two SMA antenna connectors for I/O expansion. This enables the installation of minicard and M.2 I/O modules without requiring any change to the enclosure or cabling. The elimination of custom design and manufacturing efforts dramatically reduces up-front costs and delivery times. The resulting use of common components across multiple product configurations helps keep production costs down and facilitates the production of small quantities for pilot or small-run programs.

A GMSL camera adapter board can be installed into the system to facilitate the connection of up to 8 GMSL cameras to the system. And a rugged, isolated, wide-range-input power supply featuring MIL-STD-461, -704, and -1275 compliance can be installed as an option. The power supply and Jetson module are mounted directly to the bottom and top enclosure lids, respectively, to improve heat dissipation and keep the interior cooler for more reliable long-term operation.

Geode consists of a 3-part aluminum CNC enclosure that eliminates T joints to improve sealing. All joints and connector cutouts utilize sealing gaskets to support an IP67 rating. The Geode series was designed to meet MIL-STD-810H shock and vibration specifications.

Panel I/O Board

Geode-Osbourne's internal architecture utilizes a direct-mount panel I/O board to eliminate most internal cables. The board contains a mix of standard 38999 and high-speed connectors to support the full range of I/O provided by the Jetson AGX Orin module and the carrier board electronics. It also includes a MIL-STD-461 filter for economical configurations where a full rugged MIL-grade power supply is not desired.

I/O Expansion

The Osbourne carrier board includes 2 minicard sockets and an M.2 E-Key socket for installing I/O and connectivity expansion modules. The Panel I/O board provides 3 connectors to bring out the I/O from installed expansion modules without requiring enclosure redesign. It has capacity for up to 60 I/O signals. Two SMA connectors are also provided on the front face of the enclosure for installed communications modules.