3.5" Form Factor

PC/104

PC/104-Plus

PCIe/104

PCI/104-Express

COM Express

Single Board Computers

I/O Modules

Power Supplies

Single Board Computers

I/O Modules

Power Supplies

I/O Modules

Single Board Computers

Cables

PC/104

Adapters

PC/104

PC/104-Plus

PCIe MiniCard

PC/104

PCIe MiniCard

PC/104

PC/104-Plus

PCI/104-Express

PCIe MiniCard

PC/104-Plus

PCIe MiniCard

PC/104-Plus

PCIe MiniCard

I/O Modules

Single Board Computers

I/O Modules

PC/104

PC/104-Plus

PC/104

Small form factor

Ethernet Switch Modules

Single Board Computers

Ethernet Switches

AGX Orin Solutions

ORIN Nano / NX

Nano and NX Solutions

AGX Xavier Module Solutions

TX2 / TX2i Module Solutions


Product Evolution Explained

Illustrated below are classic product evolution curves which have been influenced by various development and management strategies. They provide a clear contrast in economic expectations due to upfront development costs, the rate at which revenues are generated, risk to market acceptance, repositioning costs, and finally a prediction of total return on investment.

The inflection points shown here indicate the various stages during a product's evolution. For this case study, only the stages on the Diamond Systems curve (purple) have been labeled. While the disciplines remain the same for the other curves, the DSC curve clearly demonstrates a number of compelling factors of being a total solution provider, most notably lower development costs, shorter time to market, and longer overall product lifecycle.

Benefits of using Diamond Systems' total solution services
Accelerated Time-to-market
Shorter product development schedules at lower costs
Rapid response to product revision for greater market acceptance
Full product realization for volume manufacturing
Comprehensive supply-chain management strategies
Complete product lifecycle management
Strategies for product longevity






Diamond Systems Integrated Service Offering

Diamond Systems offers a full range of services to support your product development effort.



Levels of Integration

Level 1: Hardware Core Sub-Assemblies

Design, selection, integration and test of core board-level computing hardware.

Level 2: System Level Assemblies

Design, selection, integration and test of all system level components

Level 3: OEM Ready Solutions

Design, selection, integration and test of all system components, application specific requirements, and extended services.