Intel-based Single Board Computers
Diamond Systems offers a variety of small form factor computer boards designed around Intel processors. Ranging from the Atom Z510 and E680 up to the Core2 Duo processor, Intel's most popular embedded CPUs power Diamond's industry leading, ruggedized SBCs in both single-board and COM-based SBC formats.
Adhering to the Intel embedded roadmap product line enables us to offer long-term availability (typically 7 years) as well as wide temperature performance on most of our SBCs.
The table below summarizes our currently available products. Visit our product data pages to learn how you can benefit from Diamond Systems' Intel-based SBCs today.
| Intel CPU |
Speed |
Diamond SBC |
Form Factor |
Oper. Temp. |
Type |
| Atom E680 |
1.6GHz |
Altair |
EMX Compact |
-40ºC to +85ºC |
Single-board |
| Atom N270 |
1.6GHz |
Neptune
Pluto |
EPIC
ETX |
-20ºC to +71ºC |
COM-based |
| Atom N450 |
1.6GHz |
Neptune
Pluto |
EPIC
ETX |
-40ºC to +85ºC |
COM-based |
| Atom Z510 |
1.1GHz |
Magellan |
COM Express |
-40ºC to +85ºC |
COM-based |
| Atom Z530 |
1.6GHz |
Aurora |
PC/104 |
-40ºC to +80ºC |
Single-board |
| Core Duo LV |
1.66GHz |
Neptune
Pluto |
EPIC
ETX |
-40ºC to +85ºC |
COM-based |
| Core2 Duo LV |
1.6GHz |
Magellan |
COM Express |
-40ºC to +80ºC |
COM-based |
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Conduction Cooled SBC Advantages |
With a new and innovative approach, Diamond brings conduction cooling to the small form factor market. Now PC/104 and other small form factor SBCs and I/O cards can be used in sealed boxes without compromising ambient operating temperature or system reliability.
We design SBCs so that the major heat producing components (CPU, graphics chips, power supplies) are located on the bottom of the board, rather than the top. A heat spreader is mounted on the bottom of the SBC, where it also serves as the system's mounting platform. The heat spreader efficiently transfers heat from these components directly to the enclosure wall, without passing through the air inside the enclosure.
Conduction-cooled solutions offer multiple benefits over conventional heat sink cooling.
- More efficient heat removal
- Reduces air temperature within the enclosure, as well as its impact on other electronics
- Allows SBCs to be used in higher ambient operating temperatures
- Reduces size of the system
- Eliminates any heat sink height interference with I/O expansion modules
- Increases overall system reliability
Download our Conduction Cooling for Stackable SBCs whitepaper.
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Standards Leadership |
Diamond is committed to designing our products around open standards, providing many benefits for our customers.
The Diamond Systems logo is a trademark of Diamond Systems
Corporation. PC/104, PC/104-Plus, PCIe/104, EPIC, and EBX are trademarks of the PC/104
Embedded Consortium. SUMIT is a trademark of the SFF-SIG. All other trademarks are the properties of their respective owners.
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Markets & Applications |
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Diamond's Intel-based SBCs |
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Altair EMX Compact SBC with 1.6GHz Intel Atom E680T CPU
 
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Aurora PC/104 SBC with 1.6GHz Intel Atom Z530 CPU
 
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Magellan COM Epress SBC with 1.1GHz Intel Atom Z510 or 1.6GHz Core2Duo LV CPU
 
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Neptune EPIC SBC with 1.6GHz Intel Atom N450, 1.6GHz Intel Atom N270, or 1.66GHz CoreDuo LV CPU
 
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Pluto ETX SBC with 1.6GHz Intel Atom N270 or 1.66GHz CoreDuo LV CPU
 
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Value-added Capabilities |
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